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2004 Archive Listings

2004 Solid State Technology's WaferNEWS Newsletter Archives

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WaferNEWS Newsletter, December 27, 2004

TSMC stakes claim in immersion race

View more stories from the December 27, 2004 issue of WaferNEWS

WaferNEWS Newsletter, December 20, 2004

Chipmakers eye cutbacks to reduce inventory

View more stories from the December 20, 2004 issue of WaferNEWS

WaferNEWS Newsletter, December 13, 2004

IBM says immersion works -- at least in one microprocessor layer

View more stories from the December 13, 2004 issue of WaferNEWS

WaferNEWS Newsletter, December 6, 2004

SIA: Chip sales cling to growth, but don't expect a holiday rescue

View more stories from the December 6, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 29, 2004

VLSI: Demand, utilization rates still falling

View more stories from the November 29, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Spansion filling out Japan fab with 300mm for flash production

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Intel scraps Taipei, Beijing events on SARS fears

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

UMC, TSMC see increased revenue in March

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

N. American semiconductor equipment industry posts B-to-B of 0.99 in March

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Sony Computer Entertainment and Sony invest $1.7B in semiconductor fabrication

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Applied Materials names Michael Splinter as president, CEO

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SMA: New fab projects will lead way out of equipment downturn

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Book-to-bill drops to 0.86

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Worldwide semi market to grow in 2003, says Gartner

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Japan April chip equipment orders rise 2.0%

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Memory chipmakers staking out 12-in. territory

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Global chip sales total $12.1 billion in April says SIA

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Global chip sales increase in May, says SIA

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA revises market outlook

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Gartner: Semiconductor spending to rebound in 2003

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Semi equipment book-to-bill stuck in neutral

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEAJ: Sales of Japanese-made equipment bounce back in 2003

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Chip capacity: Nobody wants the hot potato

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Wafer prices dip, amid rising demand

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

VLSI: September book-to-bill tells a tale of two markets

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEMI: Book-to-bill dips to 0.93Spanning the globe: China, India, Japan, Malaysia, Philippines

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Asia-Pacific set to lead semi comeback

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: 2Q chip sales show healthy jump

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEMI: 2Q wafer shipments signal growth

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: Monthly, quarterly chip sales heat up

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

July book-to-bill exceeds parity level

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEMI: Book-to-bill pushes to 0.97

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

At last: North American book-to-bill achieves parity, says SEMI

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: July chip sales up, future looks bright

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Sunny mid-quarter reports brighten industry outlook

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

August book-to-bill reflects chipmakers' caution

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEMI: Book-to-bill idles at 0.91

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: August chip sales continue to climb

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEAJ: Global equipment orders hot, domestic orders not

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

AMD offers 4Q guidance, stakes 300mm territory

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Worldwide book-to-bill stays at parity in October, says VLSI

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: Chip sales continue double-digit growth

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Mid-4Q updates: Happy holidays for chipmakers!

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

VLSI: Worldwide chip figures climbing, 2004 looks even brighter

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: Chip sales on track for double-digit gains

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Intel reports record revenues, sees 300mm benefits

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

China's foundry capacity will surge in 2004

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Intel opens wallet for EUV litho

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: 2H03 chip sales streak toward the record books

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

VLSI: Global equipment orders show an Asian flavor

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: January chip sales seasonally slow, but impressive

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Chipmakers tout Black Diamond, Applied describes new low-k technology

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Bye-bye, SiGe BiCMOS in cell phones, says TI

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Europe waves flag for sub-45nm development

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

US to appeal to WTO over China chip taxes

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEAJ: Japanese equipment moving down the pipeline

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

IBM, Chartered form 90nm design program

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Chip sales keep up momentum in February, says SIA

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Intel sales slide in 1Q04, rising inventory raises eyebrows

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Semi equipment seeing a return to "rational" demand

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: First-quarter blues turn to green lights for chip industry

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Japanese equipment makers' sales tip the scales

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

IBM's 300mm yields are nearly back on track

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Chip equipment market stays hot in April

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: Another month, another high for chip sales

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Elpida to build mammoth DRAM fab

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Intel, TSMC fire up new 300mm production

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEMATECH shuts down 157nm lithography efforts

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Chipmakers firm up 300mm plans

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

US, China pace worldwide chip sales growth in May

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Intel: 2Q in line, but inventories up, profits tightening

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Trimming the fat: Lam drops CMP, Ibis embraces SOI implant tools

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Inside the numbers: Foundries report 2Q business

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Intel reports EUV progress, future plans

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

TEL, CEA Leti extend work on 300mm, advanced nodes

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

VLSI: Slowdown taking hold, keeping downturn at bay

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SEMI: July equipment demand slows, but stable growth bodes well

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Intel readies 65nm process technology for 2005

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

SIA: Chip sales growth "modest," but no big deal

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Infineon admits price fixing; accepts $160M fine

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Chipmakers' waning equipment appetite only temporary, says VLSI

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

China's first 300mm fab ramps

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Chip sales creep ahead as industry mobilizes

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Xilinx signs Toshiba as 90nm foundry

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

Chip demand slows in 3Q, but overall growth steady

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

TI sets stage for new 300mm fab, 65nm rollout

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

China firms seeking US partners for advanced processes

View more stories from the November 22, 2004 issue of WaferNEWS

WaferNEWS Newsletter, November 22, 2004

AMD sources 64-bit production to Chartered

View more stories from the November 22, 2004 issue of WaferNEWS

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