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2008 Solid State Technology's WaferNEWS Newsletter Archives

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WaferNEWS Newsletter, December 17, 2008
  • The Year Ahead: A Time for Innovation
  • Gartner: 2008 chip decline, 2009 "considerably worse"
  • SEMI: 500K jobs at risk with EU chip decline
  • Foundries face "historical lows" in utilization
View more stories from the December 17, 2008 issue of WaferNEWS

WaferNEWS Newsletter, December 16, 2008
  • Wall-to-wall IEDM; slumping industry outlooks; PV expansions; Elpida's bond dilemma
  • Latest 32nm CMOS, memory beyond flash, novel devices detailed at 2008 IEDM
  • Impressions from IEDM
  • SEMATECH optimizing advanced gate stack for 22nm low-power apps
View more stories from the December 16, 2008 issue of WaferNEWS

WaferNEWS Newsletter, December 9, 2008
  • High-k etch; Thin-film PV summit; measuring 1/f noise; "historic lows" for foundries
  • High-k etch performance for next-generation logic gate stacks
  • A measurement method for wafer-level 1/f noise
View more stories from the December 9, 2008 issue of WaferNEWS

WaferNEWS Newsletter, December 2, 2008
  • Inside Cymer's LPP EUV source; AMAT's TSV push; ashable hardmasks for ≤4xnm; 2010 bounce in tool sales?
  • When photoresist is not enough
  • Development of a production EUV source
  • Optical in situ monitoring in LED device production
View more stories from the December 2, 2008 issue of WaferNEWS

WaferNEWS Newsletter, November 25, 2008
  • Stinky economy, souring forecasts; CD-STEM, CVD polymer tech; Inside Aviza's 300mm IBD tool
  • Analysis roundup: Stinky economy, souring forecasts
  • Mining high-precision CD-STEM data for TFH manufacturing
  • Parylenes for flexible electronics and display applications
View more stories from the November 25, 2008 issue of WaferNEWS

WaferNEWS Newsletter, November 19, 2008
  • The Economic Outlook
  • WSTS chops chip estimates through 2010
  • SEMI: Wafer shipments step back in 3Q
  • Chip tool firms' turtling suggests "long, deep downturn"
View more stories from the November 19, 2008 issue of WaferNEWS

WaferNEWS Newsletter, November 18, 2008
  • 450mm redux; Display trends; Wafer-edge yield; WSTS downgrade
  • WSTS chops chip estimates through 2010
  • Photonic interconnects enable the continuation of Moore's Law
  • Japan News: Breaking down the Panasonic/Sanyo proposal
View more stories from the November 18, 2008 issue of WaferNEWS

WaferNEWS Newsletter, November 11, 2008
  • Tool metrics for NGF; scaling "Murphy's Wall"; beware "steep, persistent" downturn
  • Chip tool firms' turtling suggests "long, deep downturn"
  • IBM tips 45nm SOI process for foundry clients
  • SMIC's mystery investor revealed: Telco firm Datang buys $172M stake
View more stories from the November 11, 2008 issue of WaferNEWS

WaferNEWS Newsletter, November 4, 2008
  • Holiday, industry spending moods; SSD strategies; InGaN growth technique; G7's chip future
  • Panasonic, Sanyo rumors heat up again
  • Analyst: NAND flash meltdown spills into 2009
  • Inside Oxford/TDI's HVPE technique for InGaN growth
View more stories from the November 4, 2008 issue of WaferNEWS

WaferNEWS Newsletter, October 28, 2008
  • Hear more from EV Group, Texas Instruments, Applied Materials, Amkor and more!
View more stories from the October 28, 2008 issue of WaferNEWS

WaferNEWS Newsletter, October 28, 2008
  • EUV, PV tech insights; ISMI, IMEC reports; fighting FUD with vision
  • IMEC research energetically stacks up
  • Analysts: "Long, dark season" ahead for chip OEMs
  • Samsung, SanDisk retreat from M&A...but maybe later?
View more stories from the October 28, 2008 issue of WaferNEWS

WaferNEWS Newsletter, October 21, 2008
  • To 32nm and beyond: SPIE panel debates assortment of challenges
  • Wall-to-wall coverage: Solar Power International
  • Navigant, Gartner, Displaybank experts shed light on solar/PV tech
View more stories from the October 21, 2008 issue of WaferNEWS

WaferNEWS Newsletter, October 14, 2008
  • BACUS, Europa review; handicapping DRAM musical chairs; new lows for capex forecasts
  • Haze and sun for mask symposium
  • Europa executive panel addresses options in WLP
  • Grid parity entering "inflection zone"
View more stories from the October 14, 2008 issue of WaferNEWS

WaferNEWS Newsletter, October 7, 2008
  • EUV's reality check; Europa's wallet warning; AMD's fab-lite finale, more...
  • Slowly but surely, EUV moves toward reality
  • Advice for equipment manufacturers: Hang onto your cash
  • Reference metrology and standards: staying ahead of the ITRS
View more stories from the October 7, 2008 issue of WaferNEWS

WaferNEWS Newsletter, September 30, 2008
  • PV's "Moore's Law"; HDD's litho path; SEMI's lively panel; "groovy" slurry reduction
  • PV's "Moore's Law" required to drive increased material efficiency
  • Litho crossover at Diskcon
  • Analysts, audience mix it up at SEMI breakfast
View more stories from the September 30, 2008 issue of WaferNEWS

WaferNEWS Newsletter, September 23, 2008
  • Top MEMS market opportunities; inside Germany's PV industry; IBM's "computational scaling" push
  • Global MEMS/Microsystems markets and opportunities
  • Germany takes a bow as PV market leader
  • Printed electronics: On a roll or in a race?
View more stories from the September 23, 2008 issue of WaferNEWS

WaferNEWS Newsletter, September 16, 2008
  • Inside KLAC's new Surfscan SP2XP; IMEC/Plextronics' solar goals; China's Olympic DRAM disappointment
  • KLA-Tencor takes a tailored approach to defect detection
  • Spotlight on IMEC's latest solar collaboration
  • Ray of hope in SEMI's ugly B:B numbers?
View more stories from the September 16, 2008 issue of WaferNEWS

WaferNEWS Newsletter, September 9, 2008
  • Tegal's DRIE push; Samsung's SanDisk bet; Powerchip's inspection revamp
  • Tegal, AMMS seek "DRIE" land in MEMS
  • Market rumor: Samsung + SanDisk?
  • iSuppli: Auto MEMS sensors to surge by 2012
View more stories from the September 9, 2008 issue of WaferNEWS

WaferNEWS Newsletter, September 2, 2008
  • LSA's bright future; Elpida's final "turf war"
  • LSA at 32nm and beyond: Ultratech sees a bright future
  • SIA: July chip sales inch up on consumer demand
  • Elpida: China DRAM move is final turf battle
View more stories from the September 2, 2008 issue of WaferNEWS

WaferNEWS Newsletter, August 26, 2008
  • Solar shakeup; Intel's SSD take; MEMS teardown; industry slump extends
  • Explosive growth reshuffles Top 10 solar ranking
  • Intel's take on the HDD vs. SSD debate
  • HP optimizes low-cost processing for inkjet printheads
View more stories from the August 26, 2008 issue of WaferNEWS

WaferNEWS Newsletter, August 19, 2008
  • MoSi-ing along to 32nm
  • First issue for 450mm: Making 22nm-quality wafers is no slam dunk
  • AMAT: 3Q was a "trough," but 2009 recovery still tenuous
View more stories from the August 19, 2008 issue of WaferNEWS

WaferNEWS Newsletter, August 12, 2008
  • Japan's thin-film solar surge; Prolith's DP tweaks; more DRAM doldrums
  • Sarnoff wields SOI in bid for back-illuminated image sensors
  • Japan players bet big on emerging thin-film solar
  • Analyst: DRAM oversupplies tipping into 2009
View more stories from the August 12, 2008 issue of WaferNEWS

WaferNEWS Newsletter, August 6, 2008
  • PV market outlook: A contrarian's view
  • Charge signature flags non-visual defects
  • Litho vendors flirt with double patterning, but no date yet
View more stories from the August 6, 2008 issue of WaferNEWS

WaferNEWS Newsletter, July 29, 2008
  • SEMICON West: Videos, device-scaling, litho DP; IBM's lean manufacturing, US fab rumor
  • Pinpointing the industry disconnect between capex and utilization
  • Seeking process windows for 32nm USJs using MSA
  • Economics, design issues top device-scaling concerns
View more stories from the July 29, 2008 issue of WaferNEWS

WaferNEWS Newsletter, July 22, 2008
  • SEMICON West redux: 450mm, 32nm USJ, 3D progress
  • AMD's 2020 Vision for 450mm: Leave inefficiency behind
  • SST Direct: WCJTG speakers in their own words
  • The Riley Report: Embedded components and disappearing die
View more stories from the July 22, 2008 issue of WaferNEWS

WaferNEWS Newsletter, July 15, 2008
  • SEMI panel forecasts slump & recovery, mulls industry issues
  • IMEC, ASML: Another step closer to production-worthy EUV
  • Aviza's Cutini optimistic about 3D IC, MEMS market
View more stories from the July 15, 2008 issue of WaferNEWS

WaferNEWS Newsletter, July 8, 2008
  • Cimetrix debuting latest tool control product
  • IMEC: Fabless/fab-lite trend requires extended R&D model
View more stories from the July 8, 2008 issue of WaferNEWS

WaferNEWS Newsletter, July 1, 2008
  • MEMS preview; VLSI Symposium report; Chip, memory trend watch
  • MEMS at SEMICON West: Smaller consumer die creates need for new etch, clean processes
  • Report from the VLSI Symposium: Planar CMOS to 22nm, but no more
View more stories from the July 1, 2008 issue of WaferNEWS

WaferNEWS Newsletter, June 25, 2008
  • Toppan-IBM 22nm pact: More than meets the eye?
  • Dow Corning targets maskless lithography with latest e-beam photoresists
  • SEMI: Monthly tool demand slips to three-year lows
View more stories from the June 25, 2008 issue of WaferNEWS

WaferNEWS Newsletter, June 17, 2008
  • SIA lowers chip growth forecast, but industry resilient against macro challenges
  • Intel eyes scalable FBC technology for 15nm and beyond
  • Process integration drives the IC industry
View more stories from the June 17, 2008 issue of WaferNEWS

WaferNEWS Newsletter, June 10, 2008
  • SEMI breakfast analysis, SEMATECH litho survey, Selete's e-CMP work, what's with AMAT-ASMI?
  • Analysts parse industry strengths, challenges, opportunities at SEMI breakfast
  • SEMATECH Litho Forum: Steady progress on all fronts, surprise showing by e-beam
  • AMAT + ASMI: What's in it for both sides?
View more stories from the June 10, 2008 issue of WaferNEWS


WaferNEWS Newsletter, May 27, 2008
  • Confab redux: 3D drivers, new 450mm concerns
  • Startups hit the fast track at UK event
View more stories from the May 27, 2008 issue of WaferNEWS

WaferNEWS Newsletter, May 20, 2008
  • Industry execs mull fab efficiency, 450mm at Confab
  • Startups seeing the world through others' eyes
  • SST QuickVote: How are you spending the fed's free money?
  • Resistive memory resists definition
View more stories from the May 20, 2008 issue of WaferNEWS

WaferNEWS Newsletter, May 13, 2008
  • 450mm by 2012: Between the lines of PR lingo
  • CHIP FORENSICS: Two different approaches to integrated MEMS
  • SST QuickVote: How are you spending the fed's free money?
View more stories from the May 13, 2008 issue of WaferNEWS

WaferNEWS Newsletter, May 6, 2008
  • AMD's Grose reports success in lean manufacturing
  • SST QuickVote: How are you spending the fed's free money?
  • When is a memristor a ReRAM?
View more stories from the May 6, 2008 issue of WaferNEWS

WaferNEWS Newsletter, April 29, 2008
  • "Chindia" rushes into solar
  • SEMI targets IP protection to insure industry innovation, survival
  • SST QuickVote: Spending the fed's free money
View more stories from the April 29, 2008 issue of WaferNEWS

WaferNEWS Newsletter, April 22, 2008
  • KLAC vs. AMAT in mask defect tool duel
  • SST QuickVote: Results for 22nm litho options, and a new poll!
  • Energy costs mean externalities matter
View more stories from the April 22, 2008 issue of WaferNEWS

WaferNEWS Newsletter, April 8, 2008
  • MRS roundup: CNTs graphene, microthings, nanostuff
  • SPIE redux: Double patterning techniques, EBDW/NIL approach mainstream
  • Etching new IC materials at 32 and 22nm
View more stories from the April 8, 2008 issue of WaferNEWS

WaferNEWS Newsletter, March 25, 2008
  • Funding basic R&D, duplicating success among anticipated topics at SEMI-CHF event
  • SPIE: "It's all cleverness and trickery now"
  • Pixelated phase-shift computational techniques developed for sub-wavelength 4X maskmaking
  • There is no more noise
View more stories from the March 25, 2008 issue of WaferNEWS

WaferNEWS Newsletter, March 11, 2008
  • Tech update on SOI, 3D circuitry, and EUV at Boston SEMI breakfast
  • SPIE: And now there are three, again
  • SST On the Scene: Video interviews at SPIE
View more stories from the March 11, 2008 issue of WaferNEWS

WaferNEWS Newsletter, March 4, 2008
  • SPIE REPORT: Optics, EUV competing for the 22nm node
  • SST On the Scene: Exclusive SPIE video interviews, news updates
  • DFM matures along with industry
View more stories from the March 4, 2008 issue of WaferNEWS

WaferNEWS Newsletter, February 26, 2008
  • SPIE: Double patterning will challenge litho, metrology, push feedback, computation
  • SPIE news roundup: Gauda, Brion, MII, Dow Corning...
  • MORE NEWS FROM SPIE
  • Interconnect technology maturing
View more stories from the February 26, 2008 issue of WaferNEWS


WaferNEWS Newsletter, February 12, 2008
  • A tale of two ISS talks: "Stealth inflation" and debt worries, but CE will carry the day
  • On IITC process units and integration
View more stories from the February 12, 2008 issue of WaferNEWS

WaferNEWS Newsletter, February 5, 2008
  • Will MEMS + nanoprobes succeed flash memory scaling?
  • Analysts name DRAM winners, losers in a "disastrous" 2007
  • TSMC's Morris Chang: Healthy growth ahead as semi's become "ubiquitous"
View more stories from the February 5, 2008 issue of WaferNEWS

WaferNEWS Newsletter, January 29, 2008
  • ISS Wall Street panel: Solid growth, clean financials, alternate markets key to stock evaluations
  • Uni-Pixel sheds light on alternative to traditional LCD manufacturing
View more stories from the January 29, 2008 issue of WaferNEWS

WaferNEWS Newsletter, January 22, 2008
  • ISS: Wall Street wary of equipment stocks, but there are some bright spots
  • Sizing up a shakeout in solar PV
  • SMC highlights PV, LED, packaging materials
View more stories from the January 22, 2008 issue of WaferNEWS

WaferNEWS Newsletter, January 15, 2008
  • A recession may be coming, but not to worry, ISS hears
  • ISS panelists: Growth for 2008, "collision course" leads to stronger industry
  • Batten down the hatches for a flood of used 200mm tools
View more stories from the January 15, 2008 issue of WaferNEWS

WaferNEWS Newsletter, January 8, 2008
  • Lithography workshop report: 193nm/DEDE for 32nm, still weighing 22nm options
  • Novel device concepts explored at IEDM
  • 2007 odds and ends
View more stories from the January 8, 2008 issue of WaferNEWS


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