SST Daily Newsletter | December 6
December 6, 2011  
“Today’s Critical Electronics Manufacturing News.”
In this issue:
• Oct. chip sales flatten out annual growth expectations
• Insights from the Global Interposer Tech conference
• R&D's the key to Synopsys-Magma deal
• Oligomer organics bring solar cell efficiency near 10%
• USHIO debuts litho tools for MEMS, power device, 3D IC fab
• SUSS Microtec launches high-volume temporary wafer bonder
• AMAT's CVD launch targets BSI image sensor fab
• Technic gold-reduction packaging technology unleashed
• New FOUP buffer improves wafer movement and storage
• EVG doubles process module space in XT Frame platform
• SUSS Microtech adds ZoneBOND to wafer bonders
• MIT concentrates photovoltaics without mirrors
• Free app helps IEDM attendees stay on task
• Berkeley Lab gets new 8nm-optic microlithography tool
• Looking ahead to Intersolar Europe
• Samsung's Austin fab ramps ahead of schedule
Top stories
Oct. chip sales flatten out annual growth expectations
Wall Street watchers still see a mixed bag after tallying October chip sales, with some lingering concerns about inventories, but overall everyone seems to agree on full-year 2011 chip projections. More>>
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Insights from the Global Interposer Tech conference
At the recent Global Interposer Technology workshop at Georgia Tech, Xilinx and TSMC discussed 2.5D chip packaging technologies and others touted the potential of glass as an interposer. More>>
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R&D's the key to Synopsys-Magma deal
Synopsys' proposed USD507M takeover of rival Magma Design Automation has industry watchers wondering whether there's too much overlap, and why R&D is the key to making it work. More>>
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Oligomer organics bring solar cell efficiency near 10%
Heliatek GmbH manufactured organic solar cells with cell power conversion efficiency of 9.8%, certified by Fraunhofer ISE CalLab. The technology is a 1.1 cm2 tandem cell manufactured with an oligomer-material low-temperature deposition process. More>>
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Tech news
USHIO debuts litho tools for MEMS, power device, 3D IC fab
USHIO Inc. is introducing the UX4-MEMS FFPL 200 with the overlay accuracy of 0.5µm for manufacturing MEMS devices, mounted with a newly developed lens module. More>>
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SUSS Microtec launches high-volume temporary wafer bonder
SUSS MicroTec launched the XBS300 temporary bonder for high-volume wafer manufacturing. The Bond Cluster is configured to temporarily bond 200mm and 300mm wafers for 3D integration applications. More>>
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AMAT's CVD launch targets BSI image sensor fab
Applied Materials Inc. (AMAT) launched the Applied Producer Optiva chemical vapor deposition (CVD) system for back-side-illuminated (BSI) image sensor manufacturing. More>>
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Technic gold-reduction packaging technology unleashed
Technic Inc. is entering the last development phase on technologies to reduce gold consumption in electronics packaging and connector applications, a product group it will call "Goldeneye." More>>
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More new products
New FOUP buffer improves wafer movement and storage
Crossing Automation Inc., semiconductor fab automation product provider, introduced the Dynamic Access Recirculating Transport and Storage (DARTS) FOUP buffer to improve wafer movement and storage. More>>
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EVG doubles process module space in XT Frame platform
EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. More>>
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SUSS Microtech adds ZoneBOND to wafer bonders
Brewer Science Inc. will offer the ZoneBOND process on equipment supplier SUSS MicroTec's XBC300 and XBS300 wafer bonding platforms. More>>
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MIT concentrates photovoltaics without mirrors
MIT researchers found a way to use thermophotovoltaic devices without mirrors to concentrate the sunlight, potentially making the system much simpler and less expensive. More>>
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More industry headlines
Free app helps IEDM attendees stay on task
Solid State Technology reader Aneesh Nainani has devised a free app for iPhones/iPads/iTouch that purposefully targets IEDM: browse the conference schedule, flag papers you want to attend, show where all the sessions are at a particular time slot, browse papers by category, find the room for the next paper presentation, etc. More>>
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Berkeley Lab gets new 8nm-optic microlithography tool
The MET5 microlithography tool at the Advanced Light Source's beamline 12.0.1 will be housed in an enclosure inside a new clean room with wafer-processing facilities immediately adjacent, built by Berkeley Lab. The MET5 tool, funded by industry, incorporates a state-of-the-art, 8-nanometer optic. More>>
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Looking ahead to Intersolar Europe
On June 13, 2012, Intersolar Europe - the world's largest exhibition for the solar industry - once again opens its doors at the Munich New Trade Fair Centre in Germany. More>>
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Samsung's Austin fab ramps ahead of schedule
The company's new plant in Austin, Texas, reached its target capacity of 40,000 wafers per month in October, a month prior to its initial target, Samsung said in a statement. More>>
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News Editor
Shannon Davis
(603) 891-9145
shannond@pennwell.com

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