Apple and TSVs, top chip makers, and "betting the ranch"
Blogger Dr. Phil Garrou investigates Apple's possible move to through silicon vias for its A6 chip, and compares capex numbers to the Western trope of "betting the ranch."
Roundup: Wide I/O moves, Elpida rumors, & IBM's 22nm plan
Garrou looks at the JEDEC Wide IO standards, Elpida 3D shipments under merger rumors, and Renesas joining the 3D wide IO club. He also shares comments from IBM on 22nm and beyond.
2011 ITRS: DRAM, 3D Flash, MEMS steal the show
The 2011 International Technology Roadmap for Semiconductors (ITRS) highlights several areas of advancement: DRAM and Flash memory, and MEMS.
Direct-attach LEDs, packaging trends at Strategies in Light
The 2012 Strategies in Light conference LED Manufacturing session covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.
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