AP SemiMonthly Newsletter | February 15

In This Issue:
• Apple and TSVs, top chip makers, and "betting the ranch"
• Roundup: Wide I/O moves, Elpida rumors, & IBM's 22nm plan
• 2011 ITRS: DRAM, 3D Flash, MEMS steal the show
• Direct-attach LEDs, packaging trends at Strategies in Light
• Hesse & Knipps opens West Coast wedge bonder demo lab
• Rudolph sells metrology tool for back-end processes
• SUSS wafer bonder/debonder features up to 6 modules
• 3M debuts high-capacitance ECM for packaging, RF, more
• Kyocera doubles flip-chip assembly with new US cleanroom
• Amkor begins voluntary retirement in Japan
• Nextreme brings thin-film on-par with bulk thermoelectrics
• Universities: Enter to win a Finetech die bonder
Top stories
Apple and TSVs, top chip makers, and "betting the ranch"
Blogger Dr. Phil Garrou investigates Apple's possible move to through silicon vias for its A6 chip, and compares capex numbers to the Western trope of "betting the ranch."
Roundup: Wide I/O moves, Elpida rumors, & IBM's 22nm plan
Garrou looks at the JEDEC Wide IO standards, Elpida 3D shipments under merger rumors, and Renesas joining the 3D wide IO club. He also shares comments from IBM on 22nm and beyond.
ITRS 2011
2011 ITRS: DRAM, 3D Flash, MEMS steal the show
The 2011 International Technology Roadmap for Semiconductors (ITRS) highlights several areas of advancement: DRAM and Flash memory, and MEMS.
Direct-attach LEDs, packaging trends at Strategies in Light
The 2012 Strategies in Light conference LED Manufacturing session covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.
Tech news
Hesse & Knipps West Coast demo lab.
Hesse & Knipps opens West Coast wedge bonder demo lab
Backend packaging equipment supplier Hesse & Knipps Inc. opened a West Coast Demo and Applications Laboratory at its manufacturer rep Chalman Technologies.
Rudolph sells metrology tool for back-end processes
Rudolph delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
SUSS wafer bonder/debonder features up to 6 modules
SUSS MicroTec launched the XBC300 Gen2 for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers.
3M debuts high-capacitance ECM for packaging, RF, more
3M introed a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced EMI.
Industry news
Kyocera's San Diego flip chip facility.
Kyocera doubles flip-chip assembly with new US cleanroom
Kyocera America doubled its flip chip assembly capacity for microelectronic devices with a USD3.5m Class-10,000 cleanroom, offering lead-free processes in San Diego.
Amkor begins voluntary retirement in Japan
Amkor shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.
Nextreme brings thin-film on-par with bulk thermoelectrics
Nextreme Thermal Solutions' thin-film thermoelectric technology achieved a 60.1C temperature difference between its cold and hot sides at an ambient temperature of 24.7C.
Universities: Enter to win a Finetech die bonder
Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to US and Canadian qualified universities and colleges.
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Web Editor
Shannon Davis
603-891-9145
shannond@pennwell.com


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