Apple and TSVs, top chip makers, and "betting the ranch"
Blogger Dr. Phil Garrou investigates Apple's possible move to through silicon vias for its A6 chip, and compares capex numbers to the Western trope of "betting the ranch."
Roundup: Wide I/O moves, Elpida rumors, & IBM's 22nm plan
Garrou looks at the JEDEC Wide IO standards, Elpida 3D shipments under merger rumors, and Renesas joining the 3D wide IO club. He also shares comments from IBM on 22nm and beyond.
2011 ITRS: DRAM, 3D Flash, MEMS steal the show
The 2011 International Technology Roadmap for Semiconductors (ITRS) highlights several areas of advancement: DRAM and Flash memory, and MEMS.
Direct-attach LEDs, packaging trends at Strategies in Light
The 2012 Strategies in Light conference LED Manufacturing session covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.
Rudolph sells metrology tool for back-end processes
Rudolph delivered the first MetaPULSE metrology system to measure under bump metallization (UBM) and redistribution layers (RDL) in advanced package manufacturing.
Amkor begins voluntary retirement in Japan
Amkor shared that it cut costs through workforce reductions in Q4 2012, and announced a voluntary retirement program in Japan to continue this initiative.
To report distribution problems with this newsletter, send an e-mail to: news@apk-media.com
SST AP invites you to forward this newsletter to colleagues or associates who might be interested in our weekly news summaries.
If you are a current subscriber, you can unsubscribe from this newsletter by clicking this link:
here
You may also contact us to by clicking here or you can write to us at:
PennWell Corporation
c/o E-mail Unsubscribe
1421 South Sheridan Road
Tulsa, OK 74112
USA
If you do not subscribe to this newsletter and would like to receive it, please visit: http://www.omeda.com/apk/
