LEDs Manufacturing

In this issue:
• HB-LED-grade AlN: Throughput, cost, and performance for LEDs
• Strategies in Light: Lithography, direct-attach LEDs, packaging trends
• LED makers could diversify with GaN power electronics production
• LED market grew 9.8% to USD12.5B in 2011
• K&S capillary designed for LED wire bonding
• MoCu LED material optimizes thermal management
• Epistar installs AIXTRON high-capacity epitaxy system
• Nitrogen-rich indium nitride wafers debut
• Intematix raises USD16.2M from investors
• Verticle takes hexagonal LED chips to mass production
• OSRAM optimizes LED for efficiency, stable luminous flux
• Iljin Materials and LED maker ILJIN Semiconductor plan merger
• Attend FPD China for next-gen display technologies
• Present at coolingZONE LED 2012 in Berlin
• Present at ESTC 2012 in Amsterdam
• Attend SEMICON China

Top stories

HB-LED-grade AlN: Throughput, cost, and performance for LEDs
In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.
-Part 2: Sintering considerations
-LED packaging report reveals costs, reliability impact
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Strategies in Light: Lithography, direct-attach LEDs, packaging trends
2012 Strategies in Light conference presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.
-LED manufacturing highlights
-Costs and manufacturing
-LED expectations for the short- and long-term
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LED makers could diversify with GaN power electronics production
The GaN power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.
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LED market grew 9.8% to USD12.5B in 2011
The worldwide high-brightness LED market grew from USD11.3b in 2010 to USD12.5b in 2011, a growth rate of 9.8%, according to Strategies Unlimited, the leading market research firm in LEDs.
-HB-LED market grew 4.3% in 2011, with uneven distribution
-LED oversupply shrinks in 2012 on consumer demand uptick
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More Headlines:
• Update on China's LED subsidy
• FPD manufacturers face 2012 crunch before 2013 rebound
• Samsung approves LED business absorption
• Tablets join top 5 semiconductor markets in 2012

Product news
K&S capillary designed for LED wire bonding Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with Au or Au-alloy wires and uses a new TG ceramic material. Share:
MoCu LED material optimizes thermal management PLANSEE developed Mo-Cu R670, a new molybdenum-copper composite material for optimizing heat dissipation in LEDs. Share:
Epistar installs AIXTRON high-capacity epitaxy system Epistar installed its first AIXTRON SE CRIUS II-XL system in a 19 x 4" wafer configuration to mass produce UHB blue and white LEDs. -Chinese LED maker orders 3 AIXTRON MOCVD tools -AIXTRON MOCVD tools easier to lease in China Share:
Nitrogen-rich indium nitride wafers debut Meaglow Ltd. launched a range of nitrogen-rich InN wafers for research and industry development around the compound semiconductor material. Share:

More Headlines:
• Spectroradiometer measures LED phosphors
• Wafers sliced to 10% conventional bulk with Hyperion 3
• Automated film frame handlers increase LED/semi production
• Cleantech Solutions sends sapphire chambers to LED maker
• Shin-Etsu Chemical releases low-RI LED encapsulants
• High-thermal-conductivity die attach adhesives introduced
• UL authorized to perform Zhaga LED testing
• GTAT wins 6" sapphire ingot order from LED substrate maker
• Rubicon re-ups sapphire contract with largest customer

Business and research news
Intematix raises USD16.2M from investors Intematix received USD16m in funding from Draper Fisher Jurvetson and Crosslink Capital, as well as a new financial investor.
Verticle takes hexagonal LED chips to mass production Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.
OSRAM optimizes LED for efficiency, stable luminous flux OSRAM Opto Semiconductors released the Oslon SSL LED, using optimized LED chips and packaging technologies to boost light output.
Iljin Materials and LED maker ILJIN Semiconductor plan merger Iljin Materials, a developer and producer of elecfoils for use in the electronic components, has signed a statutory merger agreement with LED maker ILJIN Semiconductor Co. Ltd.

More Headlines:
• UV-LEDs fabbed with solution process, oxide-in-oxide design
• MIT's nanowire growth control method could optimize LEDs
• Chip substrate factory begins production in Russia
• DoD orders QD electroluminescent devices from QD Vision
• Metrology project launches in Europe for thin films
• Konica Minolta moves to MEMS for OLED-printing inkjet head

Upcoming events
Attend FPD China for next-gen display technologies Dynamic changes in the FPD industry range from new LCD, AMOLED, touch, and flexible technologies to the emergence of China as the leading consumer and manufacturer of display products. FPD China covers the entire industry supply chain.
Present at coolingZONE LED 2012 in Berlin coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, etc.
Present at ESTC 2012 in Amsterdam ESTC 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flex electronics, assembly and interconnect technologies, etc.
Attend SEMICON China SEMICON China takes place March 20-22 in Shanghai. Check out the special pavilions and events, and keynote speakers scheduled.

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News Editor
James Montgomery
603-891-9109
jamesm@Pennwell.com

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