LEDs Manufacturing Newsletter | March 14

In this issue:
• HB-LED-grade AlN: Throughput, cost, and performance for LEDs
• Strategies in Light: Lithography, direct-attach LEDs, packaging trends
• LED makers could diversify with GaN power electronics production
• LED market grew 9.8% to USD12.5B in 2011
• K&S capillary designed for LED wire bonding
• MoCu LED material optimizes thermal management
• Epistar installs AIXTRON high-capacity epitaxy system
• Nitrogen-rich indium nitride wafers debut
• Intematix raises USD16.2M from investors
• Verticle takes hexagonal LED chips to mass production
• OSRAM optimizes LED for efficiency, stable luminous flux
• Iljin Materials and LED maker ILJIN Semiconductor plan merger
• Attend FPD China for next-gen display technologies
• Present at coolingZONE LED 2012 in Berlin
• Present at ESTC 2012 in Amsterdam
• Attend SEMICON China
Top stories
AlN for LED packaging
HB-LED-grade AlN: Throughput, cost, and performance for LEDs
In this series, CMC Laboratories describes a new LED-grade AlN and what it accomplishes as a ceramic substrate. The AlN offers better heat dissipation for LED packages than alumina, at a lower cost than previous formulations.
-Part 2: Sintering considerations
-LED packaging report reveals costs, reliability impact
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Michael A. Fury
Strategies in Light: Lithography, direct-attach LEDs, packaging trends
2012 Strategies in Light conference presenters covered LED manufacture, advanced packaging, metrology and testing, high-performance materials, and other topics, such as dimming. Blogger Michael A. Fury, Techcet Group, reports.
-LED manufacturing highlights
-Costs and manufacturing
-LED expectations for the short- and long-term
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Power electronics
LED makers could diversify with GaN power electronics production
The GaN power elec market is currently small, but new entrants are ramping to production, silicon-based electronics suppliers developing GaN, and LED makers diversifying capacity to make power semis.
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EPIC forecast.
LED market grew 9.8% to USD12.5B in 2011
The worldwide high-brightness LED market grew from USD11.3b in 2010 to USD12.5b in 2011, a growth rate of 9.8%, according to Strategies Unlimited, the leading market research firm in LEDs.
-HB-LED market grew 4.3% in 2011, with uneven distribution
-LED oversupply shrinks in 2012 on consumer demand uptick
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Product news
K&S capillary designed for LED wire bonding
Kulicke & Soffa launched the LUMOS Capillary for LED die wire bonding. The capillary can bond with Au or Au-alloy wires and uses a new TG ceramic material.
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MoCu LED material optimizes thermal management
PLANSEE developed Mo-Cu R670, a new molybdenum-copper composite material for optimizing heat dissipation in LEDs.
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Epistar installs AIXTRON high-capacity epitaxy system
Epistar installed its first AIXTRON SE CRIUS II-XL system in a 19 x 4" wafer configuration to mass produce UHB blue and white LEDs.
-Chinese LED maker orders 3 AIXTRON MOCVD tools
-AIXTRON MOCVD tools easier to lease in China
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Nitrogen-rich indium nitride wafers debut
Meaglow Ltd. launched a range of nitrogen-rich InN wafers for research and industry development around the compound semiconductor material.
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Business and research news
Intematix raises USD16.2M from investors
Intematix received USD16m in funding from Draper Fisher Jurvetson and Crosslink Capital, as well as a new financial investor.
Verticle takes hexagonal LED chips to mass production
Verticle began mass production of its hexagonal-shaped LED chip Honeycomb, developed with a proprietary copper substrate and chemical chip separation technology.
OSRAM optimizes LED for efficiency, stable luminous flux
OSRAM Opto Semiconductors released the Oslon SSL LED, using optimized LED chips and packaging technologies to boost light output.
Iljin Materials and LED maker ILJIN Semiconductor plan merger
Iljin Materials, a developer and producer of elecfoils for use in the electronic components, has signed a statutory merger agreement with LED maker ILJIN Semiconductor Co. Ltd.
Upcoming events
Attend FPD China for next-gen display technologies
Dynamic changes in the FPD industry range from new LCD, AMOLED, touch, and flexible technologies to the emergence of China as the leading consumer and manufacturer of display products. FPD China covers the entire industry supply chain.
Present at coolingZONE LED 2012 in Berlin
coolingZONE LED, May 29-31 in Berlin, is soliciting technical presentations on LED energy consumption, LED packaging, heat and air-flow simulations of LED products, etc.
Present at ESTC 2012 in Amsterdam
ESTC 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flex electronics, assembly and interconnect technologies, etc.
Attend SEMICON China
SEMICON China takes place March 20-22 in Shanghai. Check out the special pavilions and events, and keynote speakers scheduled.
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Web Editor
Shannon Davis
603-891-9145
shannond@pennwell.com


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