Solid State Technology MEMS Direct| March 20, 2012 |View online
Small Times MEMS Direct | March 20, 2012
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In this issue:
• Integrated smart systems with MEMS sensors
• MEMS supply chain: Stronger after Japan’s quake
• MEMS oscillators occupy 1% of timing market, but lure entrants
• From our sponsor: PVD Solutions for Next Generation MEMS and Sensors
• Gyroscope MEMS depose accelerometers
• MEMS for mobile electronics: USD6B+ by 2016
• Large wafers enable new MEMS-based IR detectors
• Media tablets join top 5 chip end-markets in 2012
• ACUTRONIC enables economical test at the MEMS fab
• SUSS combines resist coat and develop platforms
• AMEC debuts TSV etch tool
• Multitest delivers MEMS testing for pick-and-place set ups
• MEMS at heart of new iNEMI efforts, starting with test/reliability
• Micro-optics formed with halftone gel litho, bio inspiration
• MIT designs completely 3D MEMS
• Tour Grenoble’s MEMS lines and clinical bio-MEMS labs
Top stories
MEMS sensor, STM.
Integrated smart systems with MEMS sensors
 Each MEMS sensor consists of a MEMS sensing structure, an ASIC and the package. Jay Esfandyari, Fabio Pasolini, Gang Xu, STMicroelectronics, review important features.
MEMS fabs in Japan.
MEMS supply chain: Stronger after Japan’s quake
 The Great East Japan Earthquake was "a Darwinian event" for the MEMS market. The MEMS supply chain came out of the disaster more rich, diverse, and better, shows IHS.
MEMS oscillators occupy 1% of timing market, but lure entrants
 MEMS oscillators represent <1% of the total timing market, but that hasn't stopped new makers from entering the fray, with even more on their way, says Semico.
From our sponsor: PVD Solutions for Next Generation MEMS and Sensors
 Attend the free webcast, PVD Solutions for Next Generation MEMS and Sensors, from sponsor Veeco on Monday, March 26. Register today!
Business news
Gyroscopes vs accelerometers
Gyroscope MEMS depose accelerometers
 Gyroscopes generated more revenues in 2011 than any other consumer/mobile MEMS, the first time gyroscopes topped accelerometers, reports IHS.
MEMS for mobile
MEMS for mobile electronics: USD6B+ by 2016
 Annual revenues generated by MEMS devices built into mobile devices -- including sensors, audio, displays and RF -- will exceed USD6b by 2016, shows Juniper Research.
Large wafers enable new MEMS-based IR detectors
 New MEMS thermopile players and applications are boosting market growth for infrared (IR) detectors, finds Yole Developpement.
Media tablets join top 5 chip end-markets in 2012
 Media tablets, experiencing "remarkably rapid ascension," will become the 4th largest application for semiconductors by 2014, up from 35th in 2010, according to IHS.
Product news
ACUTRONIC enables economical test at the MEMS fab
 ACUTRONIC released standard, off-the-shelf 2-axis rate tables to test several MEMS devices simultaneously. The 21-series is primarily made for MEMS manufacturers.
SUSS combines resist coat and develop platforms
 SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.
AMEC debuts TSV etch tool
 Advanced Micro-Fabrication Equipment Inc. (AMEC) uncrated the Primo TSV200E compact, ultra-high-productivity TSV etch tool for 200mm wafers.
Multitest delivers MEMS testing for pick-and-place set ups
 Multitest expanded its MEMS portfolio to pick-and-place test applications with the introduction of its test and calibration cart for the MT9510.
Tech news
MEMS at heart of new iNEMI efforts, starting with test/reliability
 iNEMI began 2 collaborative efforts related to MEMS technology, specifically reliability and test, and will host a workshop on MEMS in May.
Micro-optics formed with halftone gel litho, bio inspiration
 Researchers at the University of Massachusetts Amherst have developed a new tool for manufacturing three-dimensional shapes easily and cheaply.
MIT designs completely 3D MEMS
 MIT researchers have come up with a new approach to MEMS design that enables engineers to design 3D configurations using existing fabrication processes. They built a MEMS device that enables 3D sensing on a single chip.
Tour Grenoble’s MEMS lines and clinical bio-MEMS labs
 AEPI and CEA-Leti will co-host a site visit to CEA-Leti and other facilities on the MINATEC campus, Grenoble, following MEMS Executive Congress Europe.
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Web Editor
Shannon Davis
603-891-9145
shannond@pennwell.com


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