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:: January 12, 2006 |
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:: SST Global: Asia Pacific
Welcome to the January 2006 edition of SST Global: Asia-Pacific, a monthly e-newsletter from the editors of Solid State Technology, Microlithography World, and WaferNews. This month's issue is a comprehensive but concise collection of articles that can help our readers in the Asia-Pacific region stay on top of the latest technology developments and industry news about semiconductor manufacturing. |
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:: Korea: Using the same line for processing Cu and Al Aluminum has served as an excellent interconnect metal for 40 years, but its limitations become evident at chip geometries in the sub-0.18µm range. Jae Song, DongbuAnam Semiconductor Inc. Solid State Technology, January 2006 :: Click for Full Story :: 
:: China/Singapore: How the road to Singapore accelerated manufacturing in ChinaWith China offering the semiconductor industry new levels of manufacturing cost efficiencies and strong domestic market growth opportunities, many integrated device manufacturers (IDM), material suppliers, and chip-packaging equipment companies are moving operations to the Chinese mainland at unprecedented rates. Oded Lendner, Alan Schindler, Kulicke & Soffa Industries Inc. Solid State Technology, January 2006 :: Click for Full Story :: :: Decoding the secret to Singapore's economic development The island city-state already boasts 14 silicon wafer fabs putting out ~400K wafers/month (200mm-equivalent wafers), along with 40 IC design companies and 20 assembly and test companies. Debra Vogler, Senior Editor WaferNews, December 5, 2005 :: Click for Full Story ::
:: Analyst: India chip design industry poised for takeoff India's semiconductor design industry will nearly triple in size over the next five years to $1.7 billion, as domestic and international suppliers rush to take advantage of a fast-growing market. James Montgomery, News Editor WaferNews, December 5, 2005 :: Click for Full Story :: :: Building engineered substrates for GaN HEMT applications Layer transfer technology has been shown to be appropriate for building specific engineered substrates for GaN HEMT (high electron mobility transistor) applications. P. Bove, H. Lahreche, Picogiga Int.; B. Faure, F. Letertre, A. Boussagol, R. Langer, Soitec Solid State Technology, January 2006 :: Click for Full Story ::
:: European startups join the DFM crowd Amid the growing clamor of companies seeking to address the interface between electronic design automation and manufacturing, a group of European startups is leveraging close links with local chipmakers to develop design-for-manufacturing (DFM) tools. Chris Edwards, Contributing Editor, Europe WaferNews, December 5, 2005 :: Click for Full Story :: :: Lower-cost displays, memories driving near-term nanotech growth Nanotechnology may have a revolutionary impact on leading-edge semiconductor process technology beyond 32nm when traditional scaling reaches the fundamental limits of physics, but for at least the next five years, the significant nanotechnology applications in electronics will likely be lower-cost displays and memories. Paula Doe, Contributing Editor WaferNews, November 28, 2005 :: Click for Full Story :: :: Nanozone progress means focus and tough choices While exotic properties of materials in the nanozone (1-100nm) promise a host of new devices and applications, success in the marketplace will depend on making tough choices and focusing on developing products offering sustainable profits. Bob Haavind, Group Editorial Director WaferNews, November 28, 2005 :: Click for Full Story :: :: Shape goes critical for sub-100 nm process control A new generation CD-SEM uses critical shape metrology to extract shape information from the SEM signal. J. Foucher, CEA/LETI; G. Sundaram, D. Gorelikov, Soluris Inc. Microlithography World, November 2005 :: Click for Full Story ::
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:: SUBSCRIPTION INFORMATION  For more stories from SST's website, connect to the homepage by clicking here: http://www.solid-state.com Editor: James Montgomery - jamesm@pennwell.com SST Global: Asia Pacific Edition is delivered electronically on the second Thursday of each month at no charge. SST invites you to forward this newsletter to colleagues or associates who might be interested in our weekly news summaries. :: If you are a current subscriber, you can discontinue delivery of SST Review by clicking this UNSUBSCRIBE link: @{confirmunsubscribelink:omessage.com}@ You can also reply to the original e-mail and type "Unsubscribe" in the subject line. Or, if you prefer, you can write to us at: PennWell Corporation c/o E-mail Unsubscribe 1421 South Sheridan Road Tulsa, OK 74112 :: If you do not subscribe to this newsletter and would like to receive it, please click this link: SUBSCRIBE |
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