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:: February 21, 2006 |
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:: SST Review
: Gas/Gas Handling
In this edition of SST Review, we present articles that focus on the leading edge of technology developments in gas handling. Below you will find carefully selected articles from Solid State Technology that will provide you with a comprehensive review of recent research and development regarding solutions to current issues and challenges in gas and gas handling technology. |
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:: Fluorine plasma chemistry for high-AR dielectric etching As device sizes continue to shrink, anisotropic dielectric etching faces a daunting list of challenges that include etch selectivity, etch uniformity, aspect-ratio dependent etching, and etch stop. Data in this article show how the chemistry of two new etch molecules - C4F6 and c-C5F8 - is helping to enable anisotropic etching of dielectric materials. Bing Ji, Stephen A. Motika, Peter R. Badowski, Seksan Dheandhanoo, James R. Stets, Eugene J. Karwacki Jr., Air Products and Chemicals Solid State Technology, November 2005 :: Click for Full Story :: :: Nanometer deposition processes create new challenges for cryopumps Every time cryogenic pumps are pushed to lower pressures in semiconductor manufacturing, new and often unexpected phenomena occur. Such is the case with advanced processes needed for magnetoresistive memory, or magnetic random-access memory (MRAM), as well as for high-density hard-disk drive (HDD) read/write heads. Michael Eacobacci, Paul Amundsen, Helix Technology Corp. Solid State Technology, October 2005 :: Click for Full Story :: :: Removal of metal carbonyl and moisture impurities through POU purification of CO gas An elaborate testing methodology is used to study the impurity removal characteristics of point-of-use carbon monoxide gas purifiers. Test results demonstrate efficient removal of impurities, such as harmful metal carbonyls and moisture, from carbon monoxide gas. Raj Chakraborty, Kurt Brown, Motonobu Horikoshi, Pall Corp. Solid State Technology, July 2005 :: Click for Full Story :: :: Chamber matching and on-tool MFC adjustment achieve process repeatability To ensure process transparency when replacing mass flow controllers (MFC) or when employing new types of MFCs in a particular process, it is often desired to have the flow rate of the replacement unit match that of the previous MFC. Stuart Tison, Mykrolis Corp. Solid State Technology, May 2005 :: Click for Full Story :: :: Avoiding fire and explosion risks with proper H2 exhaust management Hydrogen is used extensively in wafer fabrication processes for epitaxial deposition in silicon and compound semiconductors. Special considerations for exhaust management are required to deal with hydrogen's flammability and the risk of explosion at various levels of gas concentrations. Joe Van Gompel, BOC Edwards Solid State Technology, February 2005 :: Click for Full Story :: :: Selectivity/etch rate trade-offs in deep and high A/R oxide etching Selective etching of silicon oxides relative to silicon or photoresist is achieved when the concentrations of CF+ and CF2+ ions in the plasma are optimized relative to CF3+. For etch applications where a metal mask can be used, the process conditions may conveniently be adjusted for maximum etch rate and high aspect-ratio capability without concern for selectivity. A.A. Chambers, Surface Technology Systems plc Solid State Technology, February 2005 :: Click for Full Story :: :: Using tunable diode laser spectroscopy to detect trace moisture in ammonia Tunable diode laser spectroscopy (TDLAS) has emerged as a potential solution for trace moisture detection in ultrahigh-purity gases. Tests show TDLAS is a viable on-line process analyzer in NH3 applications and an alternative to Fourier transform infrared spectroscopy. Hans H. Funke, Jianlong Yao, Mark W. Raynor, Matheson Tri-Gas Inc., Andrew O. Wright, Delta F Corp. Solid State Technology, October 2004 :: Click for Full Story :: :: Model-based solution for multigas mass flow control with pressure insensitivity Along with higher levels of accuracy and reliability, material delivery solutions are growing more complex. A model-based solution for multigas mass flow control promises to address these requirements with pressure-transient insensitivity and greatly improved flow-error corrections for multiple gases. Ali Shajii, Siddharth P. Nagarkatti, Paul Meneghini, Nicholas Kottenstette, MKS Instruments Inc. Solid State Technology, July 2004 :: Click for Full Story ::
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